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Configuration Options
RECOMMENDED LAND PATTERN
(NO GROUNDING CLIPS)
TOP SIDE SHOWN
RECOMMENDED LAND PATTERN
(With GROUNDING CLIPS)
TOP SIDE SHOWN
NOTES:
1. MAINTAIN 3.50 [0.138] DIA. KEEP-OUT ZONE
FREE OF COPPER, ALL PCB LAYERS.
2. (A) MINIMUM RECOMMENDED PITCH IS 39.50 [1.555],
THIS PROVIDES 7.00 [0.275] COMPONENT
EDGE-TO-EDGE SPACING, AND 0.50 [0.020]
CLEARANCE BETWEEN VICOR HEAT SINKS.
(B) MINIMUM RECOMMENDED PITCH IS 41.00 [1.614],
THIS PROVIDES 8.50 [0.334] COMPONENT
EDGE-TO-EDGE SPACING, AND 2.00 [0.079]
CLEARANCE BETWEEN VICOR HEAT SINKS.
3. V?I CHIP LAND PATTERN SHOWN FOR REFERENCE ONLY;
ACTUAL LAND PATTERN MAY DIFFER.
DIMENSIONS FROM EDGES OF LAND PATTERN
TO PUSH-PIN HOLES WILL BE THE SAME FOR
ALL FULL SIZE V?ICHIP PRODUCTS.
4. RoHS COMPLIANT PER CST-0001 LATEST REVISION.
5. UNLESS OTHERWISE SPECIFIED:
DIMENSIONS ARE MM [INCH].
TOLERANCES ARE:
X.X [X.XX] = ±0.3 [0.01]
X.XX [X.XXX] = ±0.13 [0.005]
6. PLATED THROUGH HOLES FOR GROUNDING CLIPS (33855)
SHOWN FOR REFERENCE. HEATSINK ORIENTATION AND
DEVICE PITCH WILL DICTATE FINAL GROUNDING SOLUTION.
Figure 19 — Hole location for push pin heat sink relative to V ? I Chip
vicorpower.com
800-735-6200
V?I Chip Bus Converter
B384F120T30
Rev. 2.4
Page 9 of 12
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功能描述:HV BCM BUS CONVERT 12V 300W RoHS:是 类别:电源 - 板载 >> DC DC 转换器（分解式） 系列:V-I Chip™, BCM™ 应用说明:Factorized Power Architecture and V-I Chips 产品培训模块:VI Chip Bus Converter Modules 标准包装:1 系列:V-I Chip™, BCM™ 类型:总线转换器模块 输出数:1 电压 - 输入（最小）:330V 电压 - 输入（最大）:365V 输出电压:12.5V 电流 - 输出（最大）:24A 电源（瓦） - 制造商系列:300W 电压 - 隔离:4.242kV（4242V） 应用:商用 特点:具有远程开/关功能和 UVLO 安装类型:通孔 封装/外壳:模块 尺寸/尺寸:1.28" L x 0.87" W x 0.26" H（32.5mm x 22.0mm x 6.7mm） 包装:托盘 工作温度:-55°C ~ 125°C 效率:95.3% 电源（瓦特）- 最大:300W 重量:0.031 磅（14.06g）
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